公开(公告)号：US20230164413A1

公开(公告)日：2023-05-25

申请号：US17959758

申请日：2022-10-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongjun KIM ,  Kiyun JO

IPC: H04N5/225 ,  H04M1/02

CPC classification number: H04N5/2254 ,  H04N5/2253 ,  H04N5/2252 ,  H04M1/0264

Abstract: According to various embodiments of the disclosure, a camera module and/or an electronic device including same may include: a sensor substrate, an image sensor disposed on one surface of the sensor substrate, a sensor enclosure disposed on the sensor substrate surrounding at least a part of the image sensor, and an optical element comprising a filter disposed in the sensor enclosure facing the image sensor, wherein the image sensor may be configured to detect light incident through the optical element, and the sensor enclosure may be attached to an edge of one surface of the image sensor, at least partially facing the optical element.

公开(公告)号：US20240048825A1

公开(公告)日：2024-02-08

申请号：US18484825

申请日：2023-10-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kiyun JO ,  Heeyun CHUNG ,  Jungpa SEO ,  Hwanseon LEE ,  Kihuk LEE

IPC: H04N23/45 ,  H04N23/55 ,  H04N23/69 ,  G03B17/17 ,  H04N23/51

CPC classification number: H04N23/45 ,  H04N23/55 ,  H04N23/69 ,  G03B17/17 ,  H04N23/51

Abstract: An electronic device is provided. The electronic device includes a first imaging optical system including a first image sensor, and a second imaging optical system including a second image sensor, a reflective member, a first lens group, a second lens group, and a third lens group, the first, second, and third lens groups being sequentially arranged from the reflective member to the second image sensor, the second and third lens groups being configured to slide with respect to the first lens group, and the first and second imaging optical systems being configured to satisfy a conditional expression SSW/SST>2, where SSW denotes a size of the first image sensor and SST denotes a size of the second image sensor.

公开(公告)号：US20240107141A1

公开(公告)日：2024-03-28

申请号：US18531172

申请日：2023-12-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kiyun JO ,  Jongjun KIM ,  Heeyun CHUNG ,  Kihuk LEE

IPC: H04N23/52 ,  H04N23/54

CPC classification number: H04N23/52 ,  H04N23/54

Abstract: A camera module according to an embodiment may comprise: a printed circuit board including a first opening; a housing assembly comprising a housing arranged on a first surface of the printed circuit board; a first rear member comprising a plate arranged on a second surface of the printed circuit board, and arranged to overlap with the first opening and a part of the printed circuit board; a second rear member comprising a support arranged on the second surface of the printed circuit board and including a second opening in which the first rear member is arranged, and has a thickness thicker than a thickness of the first rear member; an image sensor arranged on one surface of the first rear member and exposed toward the housing assembly through the first opening; and at least one lens aligned to have the same optical axis of the image sensor, and arranged in the inner space of the housing assembly.