公开(公告)号：US10028375B2

公开(公告)日：2018-07-17

申请号：US15177805

申请日：2016-06-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong Il Kwon ,  Tah Joon Park ,  Joon Seok Chae ,  Jong Woo Choi

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/14 ,  H05K1/11 ,  H05K1/09 ,  G06K9/00

Abstract: A fingerprint sensing device includes a board having a sensor array, a sub-board disposed on a bottom surface of the board, a circuit element disposed on the bottom surface of the board, and a through hole disposed through the sub-board, wherein the circuit element is further disposed in the through hole. A thickness of the sub-board is substantially similar to a thickness of the circuit element.