公开(公告)号：US10058154B2

公开(公告)日：2018-08-28

申请号：US15056151

申请日：2016-02-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joonyoung Jo ,  Taeseuk Kang ,  Donghyeon Kim ,  Bitna Kim ,  Hosung Bang ,  Haewon Sung

IPC: A45C11/00 ,  A45C5/02 ,  H04B1/3888 ,  G06F1/16 ,  H04M1/02 ,  H04M1/18

CPC classification number: A45C11/00 ,  A45C5/02 ,  A45C2011/001 ,  A45C2011/002 ,  A45C2011/003 ,  G06F1/1626 ,  G06F2200/1633 ,  H04B1/3888 ,  H04M1/0214 ,  H04M1/185

Abstract: A method of manufacturing a protective cover for an electronic device is disclosed. The method includes forming an inner skin by blanking, blanking an outer skin of a fabric member in a shape corresponding to the blanked inner skin, forming a preform of a protective cover by laminating the inner skin and the outer skin with each other, thermo-compressing the laminated preform along an outer peripheral edge of the protective cover and forming the protective cover by cutting at least a portion of a region where the preform is thermo-compressing by the blanking.