公开(公告)号：US20210384186A1

公开(公告)日：2021-12-09

申请号：US17106787

申请日：2020-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongcheul Kim ,  Jooyeon Kwon ,  Sangdo Park

IPC: H01L27/02 ,  H01L27/092 ,  G06F30/392

Abstract: An integrated circuit (IC) includes: a first cell including an input pin and an output pin extending in a first direction; a second cell adjacent to the first cell in the first direction and including an input pin and an output pin extending in the first direction; a first cell isolation layer extending between the first cell and the second cell in a second direction crossing the first direction; and a first wire extending in the first direction, overlapping the first cell isolation layer, and being connected to the output pin of the first cell and the input pin of the second cell, wherein the output pin of the first cell, the input pin of the second cell, and the first wire are formed in a first conductive layer as a first pattern extending in the first direction.

公开(公告)号：US11557584B2

公开(公告)日：2023-01-17

申请号：US17106787

申请日：2020-11-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongcheul Kim ,  Jooyeon Kwon ,  Sangdo Park

IPC: H01L27/02 ,  G06F30/392 ,  H01L27/092 ,  H01L23/528

Abstract: An integrated circuit (IC) includes: a first cell including an input pin and an output pin extending in a first direction; a second cell adjacent to the first cell in the first direction and including an input pin and an output pin extending in the first direction; a first cell isolation layer extending between the first cell and the second cell in a second direction crossing the first direction; and a first wire extending in the first direction, overlapping the first cell isolation layer, and being connected to the output pin of the first cell and the input pin of the second cell, wherein the output pin of the first cell, the input pin of the second cell, and the first wire are formed in a first conductive layer as a first pattern extending in the first direction.