公开(公告)号：US10374286B2

公开(公告)日：2019-08-06

申请号：US14945597

申请日：2015-11-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-Sik Park ,  Yeon-Woo Kim ,  Woo-Sup Lee ,  Seung-Gil Jeon ,  Ju-Seok Noh ,  Jae-Bong Chun ,  Hyun-Ju Hong

IPC: H01Q1/24 ,  H01Q1/44 ,  H01Q9/42

Abstract: An electronic device comprising: a housing; a wireless communication transceiver provided within the housing; an antenna radiator provided within the housing; and a cover arranged to cover at least a portion of the antenna radiator and form at least a portion of a surface of the housing, wherein the cover includes a conductive material, and the cover is at least partially detachable from the housing.