IMAGE SENSOR DEVICE
    1.
    发明申请

    公开(公告)号:US20250126908A1

    公开(公告)日:2025-04-17

    申请号:US18999977

    申请日:2024-12-23

    Abstract: An image sensor device includes a digital pixel that includes a photo detector, a comparator, and a memory circuit, a pixel driver that controls the digital pixel, and a digital logic circuit that performs a digital signal processing operation on a digital signal output from the digital pixel. The photo detector and a first portion of the comparator are formed in a first semiconductor die, a second portion of the comparator, the memory circuit, and the pixel driver are formed in a second semiconductor die under the first semiconductor die, and the digital logic circuit is formed in a third semiconductor die under the second semiconductor die.

    IMAGE SENSOR DEVICE
    2.
    发明申请

    公开(公告)号:US20220336507A1

    公开(公告)日:2022-10-20

    申请号:US17856022

    申请日:2022-07-01

    Abstract: An image sensor device includes a digital pixel that includes a photo detector, a comparator, and a memory circuit, a pixel driver that controls the digital pixel, and a digital logic circuit that performs a digital signal processing operation on a digital signal output from the digital pixel. The photo detector and a first portion of the comparator are formed in a first semiconductor die, a second portion of the comparator, the memory circuit, and the pixel driver are formed in a second semiconductor die under the first semiconductor die, and the digital logic circuit is formed in a third semiconductor die under the second semiconductor die.

    IMAGE SENSOR DEVICE
    3.
    发明申请
    IMAGE SENSOR DEVICE 审中-公开

    公开(公告)号:US20200258926A1

    公开(公告)日:2020-08-13

    申请号:US16591059

    申请日:2019-10-02

    Abstract: An image sensor device includes a digital pixel that includes a photo detector, a comparator, and a memory circuit, a pixel driver that controls the digital pixel, and a digital logic circuit that performs a digital signal processing operation on a digital signal output from the digital pixel. The photo detector and a first portion of the comparator are formed in a first semiconductor die, a second portion of the comparator, the memory circuit, and the pixel driver are formed in a second semiconductor die under the first semiconductor die, and the digital logic circuit is formed in a third semiconductor die under the second semiconductor die.

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