公开(公告)号：US20240145514A1

公开(公告)日：2024-05-02

申请号：US18237278

申请日：2023-08-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： JAESUNG HUR ,  HAJIN LIM ,  TAEKSOO JEON ,  KI JOONG YOON ,  JONGMIN JEON

IPC: H01L27/146

CPC classification number: H01L27/14634 ,  H01L27/14636 ,  H01L27/1469

Abstract: An image sensor includes a first chip and a second chip. The first chip includes a first substrate including photoelectric conversion parts and a back-side insulating layer covering a first surface of the first substrate. The second chip, which is disposed adjacent the first chip, includes circuits configured to drive the first chip. The back-side insulating layer may include a fixed-charge layer, a refractive index adjusting layer, and a capping layer, which are sequentially disposed on the first surface of the first substrate. The refractive index adjusting layer may include a first element, a second element, and oxygen. A conduction band minimum of an oxide of the second element may be higher than a conduction band minimum of an oxide of the first element.