公开(公告)号：US20230163070A1

公开(公告)日：2023-05-25

申请号：US18151731

申请日：2023-01-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonsung KIM ,  Khaile KIM

IPC: H01L23/528 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L23/528 ,  H01L24/05 ,  H01L23/3178 ,  H01L23/49861

Abstract: A fan-out semiconductor package includes a frame substrate having a through hole therein, a semiconductor chip in the through hole, wherein the semiconductor chip includes a chip body, a chip pad on a surface of the chip body and a passivation layer on the chip body and on the chip pad, an encapsulation layer on side surfaces of the semiconductor chip within the through hole, and a guard ring on the passivation layer and on an edge portion of the chip body.

公开(公告)号：US20240421058A1

公开(公告)日：2024-12-19

申请号：US18644867

申请日：2024-04-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minkyu KIM ,  Dahee KIM ,  Khaile KIM ,  Kyuil HWANG

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/538

Abstract: A semiconductor package may include a package structure on a redistribution structure. The redistribution structure may include a wiring structure and an insulating structure covering the wiring structure. The package structure may include a semiconductor chip connected to the wiring structure. The insulating structure of the redistribution structure may include a plurality of first insulating layers and a second insulating layer between the plurality of first insulating layers. The plurality of first insulating layers may include at least one of a first conductive line pattern and a first conductive via pattern. The second insulating layer may include a second conductive line pattern overlapping the first conductive line pattern in a vertical direction.