公开(公告)号：US09406369B2

公开(公告)日：2016-08-02

申请号：US14325867

申请日：2014-07-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong-Hyun Seok ,  Dohyung Kim ,  Kwangseop Kim ,  Young-Ho Lee

IPC: H01L23/34 ,  G11C11/401 ,  G11C5/02 ,  G11C5/04

CPC classification number: G11C11/401 ,  G11C5/025 ,  G11C5/04

Abstract: A memory module includes a printed circuit board; first memory chips disposed in parallel with a long axis of the printed circuit board along a first column; second memory chips disposed in parallel with the long axis of the printed circuit board along a second column; and passive elements disposed between the first memory chips and the second memory chips, wherein the passive elements are connected between input/output pins of each of the first and second memory chips and tap pins.

Abstract translation: 存储模块包括印刷电路板; 第一存储器芯片，沿着第一列与印刷电路板的长轴平行设置; 第二存储器芯片沿着第二列与印刷电路板的长轴平行布置; 以及设置在所述第一存储器芯片和所述第二存储器芯片之间的无源元件，其中所述无源元件连接在所述第一存储器芯片和所述第二存储器芯片中的每一个的输入/输出引脚之间。