公开(公告)号：US20240031727A1

公开(公告)日：2024-01-25

申请号：US17425538

申请日：2020-01-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Haekeu PARK ,  Kyeongcheol YOON ,  Hyeonyeong JEONG ,  Sunghoon CHO ,  Seonmi KIM ,  Jeock LEE ,  Seyoun KWON

IPC: H04R1/10

CPC classification number: H04R1/1075 ,  H04R1/1016 ,  H04R1/1041 ,  H04R2400/11

Abstract: A headset including an in-ear microphone is disclosed, the headset including a first frame including a first surface toward a first direction, a second surface toward a second direction opposite to the first direction, and a side surface surrounding at least part of a space between the first surface and the second surface, a speaker seating portion formed by recessing by a specific depth from a first portion of the first surface toward the second surface, a space formed between the speaker seating portion and the second surface, a speaker hole penetrated from the speaker seating portion to the space, a microphone hole penetrated from a second portion of the first surface to the space, an acoustic hole formed by penetrating the second surface from the space, a speaker seated in the speaker seating portion, a first printed circuit board disposed on the second portion and having a via hole connected with the microphone hole, a second printed circuit board electrically connected with the first printed circuit board and a connection unit of the speaker, and a microphone mounted at a position aligned with the via hole on the first printed circuit board. Various other embodiments identified in this document are also possible.