公开(公告)号：US20230127641A1

公开(公告)日：2023-04-27

申请号：US17862662

申请日：2022-07-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunghwan KIM ,  Kyonghwan KOH ,  Jungjoo KIM ,  Jongwan KIM ,  Junwoo PARK ,  Hyunggil BAEK ,  Yongkwan LEE ,  Dongju JANG ,  Taejun JEON

IPC: H01L21/56 ,  H01L23/00 ,  H01L25/10 ,  H01L23/498 ,  H01L23/31

Abstract: A method of manufacturing a semiconductor package may include providing a substrate having first and second cutting regions respectively provided along first and second side portions opposite to each other and a mounting region between the first and second cutting regions is provided, disposing at least one semiconductor chip on the mounting region, forming a molding member on the substrate, and removing a dummy curl portion and at least portions of dummy runner portions from the molding member. The molding member may include a sealing portion, the dummy curl portion provided outside the second side portion of the substrate, and the plurality of dummy runner portions on the second cutting region to connect the sealing portion and the dummy curl portion. The substrate may include adhesion reducing pads in the second cutting region, which may contact the dummy runner portions respectively.