公开(公告)号：US20200343219A1

公开(公告)日：2020-10-29

申请号：US16923418

申请日：2020-07-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong-hoon KIM ,  Kil-soo KIM ,  Kyung-suk OH ,  Tae-joo HWANG

IPC: H01L25/065 ,  H01L23/552 ,  H01L23/367 ,  H04M1/02

Abstract: An electronic device includes a circuit board, a semiconductor device package mounted on the circuit board, the semiconductor device package including a package substrate connected to the circuit board, a first semiconductor device and a second semiconductor device mounted side by side on the package substrate, and a molding surrounding a sidewall of the first semiconductor device and a sidewall of the second semiconductor device, the molding not covering a top surface of the first semiconductor device, and a heat dissipation structure on the semiconductor device package, the top surface of the first semiconductor device being in contact with the heat dissipation structure.

公开(公告)号：US20190386050A1

公开(公告)日：2019-12-19

申请号：US16251368

申请日：2019-01-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JI-HWANG KIM ,  Kyung-suk OH

IPC: H01L27/146

Abstract: An image sensor including: a semiconductor substrate having a first region and a second region; an isolation region filling an isolation trench that partially penetrates the semiconductor substrate; a plurality of photoelectric conversion regions defined by the isolation region and forming a first hexagonal array on a plane that is parallel to a surface of the semiconductor substrate; and a plurality of microlenses respectively corresponding to the plurality of photoelectric conversion regions, and forming a second hexagonal array on the plane that is parallel to the surface of the semiconductor substrate.

公开(公告)号：US20190295917A1

公开(公告)日：2019-09-26

申请号：US16190825

申请日：2018-11-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kil-soo KIM ,  Yong-hoon KIM ,  Hyun-ki KIM ,  Kyung-suk OH

IPC: H01L23/367 ,  H01L23/31 ,  H01L25/065 ,  H01L23/552 ,  H01L23/00

Abstract: A semiconductor package includes a package substrate, a lower semiconductor chip on the package substrate, a heat emission member on the lower semiconductor chip, the heat emission member having a horizontal unit and a vertical unit connected to the horizontal unit, a first semiconductor chip stack and a second semiconductor chip stack on the horizontal unit, and a molding member that surrounds the lower semiconductor chip, the first and second semiconductor chip stacks, and the heat emission member. The vertical unit may be arranged between the first semiconductor chip stack and the second semiconductor chip stack, and an upper surface of the vertical unit may be exposed in the molding member.

公开(公告)号：US20190148337A1

公开(公告)日：2019-05-16

申请号：US16002018

申请日：2018-06-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-hoon KIM ,  Kil-soo KIM ,  Kyung-suk OH ,  Tae-joo HWANG

IPC: H01L25/065 ,  H01L23/552 ,  H01L23/367

Abstract: An electronic device includes a circuit board, a semiconductor device package mounted on the circuit board, the semiconductor device package including a package substrate connected to the circuit board, a first semiconductor device and a second semiconductor device mounted side by side on the package substrate, and a molding surrounding a sidewall of the first semiconductor device and a sidewall of the second semiconductor device, the molding not covering a top surface of the first semiconductor device, and a heat dissipation structure on the semiconductor device package, the top surface of the first semiconductor device being in contact with the heat dissipation structure.