公开(公告)号：US20180168035A1

公开(公告)日：2018-06-14

申请号：US15835223

申请日：2017-12-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Man Ho KIM ,  Hwa Joong JUNG ,  Tae Yun KIM ,  Yong Hwan CHOI ,  Ki Huk LEE

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K1/18

Abstract: According to an embodiment, a printed circuit board and an electronic device is disclosed. The printed circuit board includes a first pattern configured to be formed in a first layer. The printed circuit board also includes a second pattern configured to be formed in at least one second layer under the first layer. The printed circuit board also includes a via configured to electrically connect the first pattern to the second pattern. The printed circuit board further includes a recess configured to be formed by removing at least a portion of an area in which the via is formed and to electrically separate the first pattern from the second pattern.