公开(公告)号：US20180033013A1

公开(公告)日：2018-02-01

申请号：US15663355

申请日：2017-07-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong Seok PARK ,  Seong II KIM ,  In Ho KIM ,  Tae Yun KIM ,  Seung Won OH ,  Ji Su OH ,  Yong Wan LEE ,  You Na LEE ,  Dong Ho JANG ,  Jae Man CHO

IPC: G06Q20/40 ,  G06Q20/32

CPC classification number: G06Q20/40145 ,  G06Q20/20 ,  G06Q20/325 ,  G06Q20/327 ,  G06Q20/3278 ,  G06Q20/405 ,  G06Q20/4097

Abstract: An electronic device and a method of payment by the electronic device are provided. The electronic device includes a local wireless communication circuit, a first biometric sensor and a second biometric sensor, a security module configured to store payment information corresponding to a payment card, a processor electrically connected to the first biometric sensor, the second biometric sensor, the local wireless communication circuit, and the security module, and a memory electrically connected to the processor, wherein the memory is configured to store instructions that cause the processor to select at least one of the first biometric sensor or the second biometric sensor, based on a security policy of an issuer of the payment card or a security policy of the payment card, authenticate a user by using the selected biometric sensor, and if the authentication is successful, transmit the payment information to an external device through the local wireless communication circuit.

公开(公告)号：US20180168035A1

公开(公告)日：2018-06-14

申请号：US15835223

申请日：2017-12-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Man Ho KIM ,  Hwa Joong JUNG ,  Tae Yun KIM ,  Yong Hwan CHOI ,  Ki Huk LEE

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K1/18

Abstract: According to an embodiment, a printed circuit board and an electronic device is disclosed. The printed circuit board includes a first pattern configured to be formed in a first layer. The printed circuit board also includes a second pattern configured to be formed in at least one second layer under the first layer. The printed circuit board also includes a via configured to electrically connect the first pattern to the second pattern. The printed circuit board further includes a recess configured to be formed by removing at least a portion of an area in which the via is formed and to electrically separate the first pattern from the second pattern.