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公开(公告)号：US11811185B2
公开(公告)日：2023-11-07
申请号：US17367802
申请日：2021-07-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Young-chul Kwon , Dong-woo Kang , Man-hee Han
CPC classification number: H01S3/0085 , G02B5/3083 , G02B27/0927 , G02B27/286
Abstract: A laser dicing device includes: a Gaussian laser beam emitter configured to emit a Gaussian laser beam having a Gaussian energy distribution; a laser beam modulator configured to modulate a shape of the emitted Gaussian laser beam by reducing intensity in a region surrounding a first line parallel with a laser dicing direction of the emitted Gaussian beam, the first line crossing a center of the Gaussian laser beam in a plan view; a focusing lens configured to focus a modulated Gaussian laser beam modulated by the laser beam modulator; and a substrate support configured that a substrate to be diced is seated on the support, wherein the focusing lens is configured to collect the modulated Gaussian laser beam inside the substrate seated on the substrate support.
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Patent Agency Ranking
2.发明申请公开(公告)号：US20190279904A1
公开(公告)日：2019-09-12
申请号：US16297950
申请日：2019-03-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Byong-gook Jeong , Byung-ho Kim , Youn-jo Mun , Jeong-cheol An , Sung-il Cho , Dae-sang Chun , Man-hee Han
IPC: H01L21/78 , H01L21/02 , H01L21/268
Abstract: A method of fabricating a semiconductor package includes providing a substrate on a stage, the substrate including semiconductor dies and a modified layer along a partition lane and sequentially having an adhesive film and a base film on a surface thereof so that bottom surfaces of the adhesive film and the base film face the stage and top surfaces of the adhesive film and the base film face away from the stage and the bottom surface of the adhesive film faces the top surface of the base film; separating the semiconductor dies from each other by applying a force to the substrate in a lateral direction; applying a gas pressure to a top surface of each of the semiconductor dies; and irradiating ultraviolet rays toward the adhesive film after applying the gas pressure on the top surface of each of the semiconductor dies.
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公开(公告)号：US20210336401A1
公开(公告)日：2021-10-28
申请号：US17367802
申请日：2021-07-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Young-chul Kwon , Dong-woo Kang , Man-hee Han
Abstract: A laser dicing device includes: a Gaussian laser beam emitter configured to emit a Gaussian laser beam having a Gaussian energy distribution; a laser beam modulator configured to modulate a shape of the emitted Gaussian laser beam by reducing intensity in a region surrounding a first line parallel with a laser dicing direction of the emitted Gaussian beam, the first line crossing a center of the Gaussian laser beam in a plan view; a focusing lens configured to focus a modulated Gaussian laser beam modulated by the laser beam modulator; and a substrate support configured that a substrate to be diced is seated on the support, wherein the focusing lens is configured to collect the modulated Gaussian laser beam inside the substrate seated on the substrate support.
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公开(公告)号：US10741448B2
公开(公告)日：2020-08-11
申请号：US16297950
申请日：2019-03-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Byong-gook Jeong , Byung-ho Kim , Youn-jo Mun , Jeong-cheol An , Sung-il Cho , Dae-sang Chun , Man-hee Han
IPC: H01L21/78 , H01L21/02 , H01L21/268
Abstract: A method of fabricating a semiconductor package includes providing a substrate on a stage, the substrate including semiconductor dies and a modified layer along a partition lane and sequentially having an adhesive film and a base film on a surface thereof so that bottom surfaces of the adhesive film and the base film face the stage and top surfaces of the adhesive film and the base film face away from the stage and the bottom surface of the adhesive film faces the top surface of the base film; separating the semiconductor dies from each other by applying a force to the substrate in a lateral direction; applying a gas pressure to a top surface of each of the semiconductor dies; and irradiating ultraviolet rays toward the adhesive film after applying the gas pressure on the top surface of each of the semiconductor dies.
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5.发明申请公开(公告)号：US20200006909A1
公开(公告)日：2020-01-02
申请号：US16354686
申请日：2019-03-15
Applicant: Samsung Electronics Co., Ltd.
Inventor： Young-chul Kwon , Dong-woo Kang , Man-hee Han
Abstract: A laser dicing device includes: a Gaussian laser beam emitter configured to emit a Gaussian laser beam having a Gaussian energy distribution; a laser beam modulator configured to modulate a shape of the emitted Gaussian laser beam by reducing intensity in a region surrounding a first line parallel with a laser dicing direction of the emitted Gaussian beam, the first line crossing a center of the Gaussian laser beam in a plan view; a focusing lens configured to focus a modulated Gaussian laser beam modulated by the laser beam modulator; and a substrate support configured that a substrate to be diced is seated on the support, wherein the focusing lens is configured to collect the modulated Gaussian laser beam inside the substrate seated on the substrate support.
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公开(公告)号：US11075496B2
公开(公告)日：2021-07-27
申请号：US16354686
申请日：2019-03-15
Applicant: Samsung Electronics Co., Ltd.
Inventor： Young-chul Kwon , Dong-woo Kang , Man-hee Han
Abstract: A laser dicing device includes: a Gaussian laser beam emitter configured to emit a Gaussian laser beam having a Gaussian energy distribution; a laser beam modulator configured to modulate a shape of the emitted Gaussian laser beam by reducing intensity in a region surrounding a first line parallel with a laser dicing direction of the emitted Gaussian beam, the first line crossing a center of the Gaussian laser beam in a plan view; a focusing lens configured to focus a modulated Gaussian laser beam modulated by the laser beam modulator; and a substrate support configured that a substrate to be diced is seated on the support, wherein the focusing lens is configured to collect the modulated Gaussian laser beam inside the substrate seated on the substrate support.
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