公开(公告)号：US20240414255A1

公开(公告)日：2024-12-12

申请号：US18808796

申请日：2024-08-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minkuk Kim ,  Soobum Lee ,  Baekeun Cho

IPC: H04M1/02 ,  H05K5/03 ,  H05K9/00

Abstract: An electronic device is disclosed. The electronic device may comprise: a housing, a circuit board disposed inside the housing, a first electric element disposed on the circuit board, and a shielding member fixed to the circuit board by an adhesive material. The shielding member may have a shielding space formed therein and include a plate and a sidewall extending from a circumference of the plate towards the circuit board. The sidewall may include an inside surface facing the shielding space, an outside surface opposite to the inside surface, and a bottom surface facing the circuit board. The sidewall includes at least one protrusion extending toward the circuit board. The at least one protrusion may include at least one recess formed through the side wall on the bottom surface. At least part of the adhesive material may be received in the at least one recess.

公开(公告)号：US12069196B2

公开(公告)日：2024-08-20

申请号：US17282399

申请日：2019-10-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minkuk Kim ,  Soobum Lee ,  Baekeun Cho

IPC: H05K9/00 ,  H04M1/02 ,  H05K5/03

CPC classification number: H04M1/0277 ,  H04M1/0266 ,  H05K9/0028 ,  H05K9/0032 ,  H05K5/03

Abstract: An electronic device is disclosed. The electronic device may comprise: a housing; a substrate disposed inside the housing and comprising a first electric element and an adhesive material; and a shielding material fixed to the substrate by the adhesive material, the shielding member having a shielding space formed therein, the first electric element being disposed in the shielding space. The shielding member may comprise: a plate facing the substrate; and a side wall formed between the plate and the substrate so as to connect the plate and the substrate, the side wall extending in a peripheral direction so as to surround the shielding space. The adhesive material may be disposed on the substrate so as to surround at least a part of the side wall. The side wall may comprise: an outer surface directed toward the shielding space; an inner surface disposed opposite the outer surface; and a bottom surface facing the substrate. The adhesive material has at least a part formed to at least partially cover the outer surface and the inner surface. At least one of the outer surface and the inner surface may have a recess formed therein so as to contain the adhesive material. Various other embodiments understood from the specification are also possible.