公开(公告)号：US20250118574A1

公开(公告)日：2025-04-10

申请号：US18826678

申请日：2024-09-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeonggi Jin ,  Jinwoo Park ,  Byoungwook Jang ,  Byungmin Yu ,  Moogun Lee

IPC: H01L21/56 ,  H01L21/48 ,  H01L21/683 ,  H01L21/78 ,  H01L23/00

Abstract: A method of manufacturing a semiconductor package includes providing a fan-out wafer on a support member, where the fan-out wafer includes a plurality of package regions and a plurality of dummy regions along an edge of the fan-out wafer, and where the plurality of package regions are divided by a cutting region, attaching the fan-out wafer to an adhesive member that is on a ring frame, forming a sealing member along the edge of the fan-out wafer and on the adhesive member to at least partially surround a plurality of dummy packages on the plurality of dummy regions, and cutting the fan-out wafer along the cutting region to separate the plurality of package regions.