公开(公告)号：US20160005707A1

公开(公告)日：2016-01-07

申请号：US14754686

申请日：2015-06-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-Hwan KWON ,  Myeong-Soon PARK ,  Chan-Ho LEE

IPC: H01L23/00

Abstract: A semiconductor package includes a package board that includes an circuit pattern and a plurality of contact pads electrically connected to the circuit pattern; a semiconductor chip having a plurality of chip pads; and a bump structure including a plurality of connecting bumps electrically connected with the semiconductor chip and the circuit pattern and a plurality of gap adjusting bumps bonded to the semiconductor chip and shaped into a slender bar between the semiconductor chip and the package board, the gap adjusting bumps spacing the semiconductor chip from the package board such that a gap space, S, is maintained between the package board and the semiconductor chip. A method of fabrication and a memory unit are disclosed.

Abstract translation: 半导体封装包括封装板，其包括电路图案和电连接到电路图案的多个接触焊盘; 具有多个芯片焊盘的半导体芯片; 以及包括与所述半导体芯片和所述电路图案电连接的多个连接凸块的多个凸块结构以及与所述半导体芯片接合并成形为半导体芯片和所述封装板之间的细长棒的多个间隙调整凸块，所述间隙调整 凸块将半导体芯片与封装板间隔开，从而在封装板和半导体芯片之间保持间隙空间S. 公开了一种制造方法和存储单元。