公开(公告)号：US20230145476A1

公开(公告)日：2023-05-11

申请号：US17833438

申请日：2022-06-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongha JEONG ,  Kyung-Sun KIM ,  Dongwan KIM ,  Donghyeon NA ,  Dougyong SUNG ,  Myeongsoo SHIN ,  Ungyo JUNG

IPC: H01L21/683 ,  C23C16/458

CPC classification number: H01L21/6833 ,  C23C16/4585 ,  C23C16/4586

Abstract: A chuck assembly includes a chuck base including a lower base and an upper base that is on the lower base, a ceramic plate on the upper base, an isolator ring enclosing an outer sidewall of the lower base, a focus ring on an edge portion of the lower base and the isolator ring, the focus ring enclosing an outer sidewall of the upper base, and a pad that is between the edge portion of the lower base and the focus ring. The pad may contain a nonmetal conductive material.