公开(公告)号：US20210104381A1

公开(公告)日：2021-04-08

申请号：US16871427

申请日：2020-05-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kangmin JEON ,  Dougyong SUNG ,  Jongwoo SUN ,  Minkyu SUNG ,  Kimoon JUNG ,  Seongha JEONG ,  Ungyo JUNG ,  Jewoo HAN

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/311

Abstract: A gas supply assembly for a substrate processing apparatus includes a gas introduction part, a gas distribution plate connected to the gas introduction part, the gas distribution plate including a plurality of through holes, and a shower head disposed under the gas distribution plate, the shower head including a plurality of distribution holes in fluid communication with the plurality of through holes. One through hole is in fluid communication with at least two distribution holes, and each of the plurality of distribution holes has a first diameter and a second diameter differing from each other in the shower head.

公开(公告)号：US20230145476A1

公开(公告)日：2023-05-11

申请号：US17833438

申请日：2022-06-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongha JEONG ,  Kyung-Sun KIM ,  Dongwan KIM ,  Donghyeon NA ,  Dougyong SUNG ,  Myeongsoo SHIN ,  Ungyo JUNG

IPC: H01L21/683 ,  C23C16/458

CPC classification number: H01L21/6833 ,  C23C16/4585 ,  C23C16/4586

Abstract: A chuck assembly includes a chuck base including a lower base and an upper base that is on the lower base, a ceramic plate on the upper base, an isolator ring enclosing an outer sidewall of the lower base, a focus ring on an edge portion of the lower base and the isolator ring, the focus ring enclosing an outer sidewall of the upper base, and a pad that is between the edge portion of the lower base and the focus ring. The pad may contain a nonmetal conductive material.