Electronic device including vibration damping member

    公开(公告)号:US10993022B2

    公开(公告)日:2021-04-27

    申请号:US16749808

    申请日:2020-01-22

    Abstract: An electronic device includes a housing including a front plate forming a first surface, a back plate forming a second surface, and a side member forming a side surface surrounding a space between the first and second surfaces; a sound output device disposed in the housing; an electrical component disposed in the housing and having a variable thickness; and a vibration damping member disposed on at least part of the electrical component or formed between the electrical component and the back plate. The vibration damping member is disposed in a variable space having a thickness varying depending on a thickness variation of the electrical component. The vibration damping member has a height varying in a thickness direction of the variable space to correspond to the thickness of the variable space and divides the variable space into a plurality of sub-spaces when the variable space has a specified thickness or more.

    Electronic device having plurality of acoustic ducts

    公开(公告)号:US12219311B2

    公开(公告)日:2025-02-04

    申请号:US17862841

    申请日:2022-07-12

    Abstract: The electronic device including the plurality of acoustic ducts according to various example embodiments may include the main body; the PCB disposed on the main body; the microphone including the microphone body connected to the PCB and the diaphragm connected to the microphone body; the main acoustic duct penetrating the main body and configured to connect the space in which the diaphragm is placed to the external space of the electronic device; and the sub acoustic duct penetrating the main body and configured to connect the external space of the electronic device to the main acoustic duct. In addition, various example embodiments are possible.

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