公开(公告)号：US20250132280A1

公开(公告)日：2025-04-24

申请号：US18895900

申请日：2024-09-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hansol Yoo ,  Myoungchul Eum

IPC: H01L23/00 ,  H01L21/56 ,  H01L25/18 ,  H10B80/00

Abstract: A chip attach film includes an adhesive layer, and a filler dispersed in the adhesive layer and including an organic material, wherein a thickness of the adhesive layer is about 0.5 μm to about 3 μm, and wherein an average particle diameter of the filler is equal to or greater than about 0.8 times the thickness of the adhesive layer, and less than about 1 times the thickness of the adhesive layer.

公开(公告)号：US20240096839A1

公开(公告)日：2024-03-21

申请号：US18214124

申请日：2023-06-26

Applicant: Samsung Electronics Co. Ltd.

Inventor： Seonho Lee ,  Myoungchul Eum

IPC: H01L23/00 ,  H01L25/065

CPC classification number: H01L24/32 ,  H01L24/16 ,  H01L24/29 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73204

Abstract: A semiconductor package includes a buffer die, a first core die disposed on the buffer die, and a non-conductive film (NCF) disposed between the buffer die and the first core die so that the buffer die and the first core die are bonded to each other, wherein the NCF includes a dibenzocyclooctadiene (DBCOD)-based compound.