公开(公告)号：US20250132280A1

公开(公告)日：2025-04-24

申请号：US18895900

申请日：2024-09-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hansol Yoo ,  Myoungchul Eum

IPC: H01L23/00 ,  H01L21/56 ,  H01L25/18 ,  H10B80/00

Abstract: A chip attach film includes an adhesive layer, and a filler dispersed in the adhesive layer and including an organic material, wherein a thickness of the adhesive layer is about 0.5 μm to about 3 μm, and wherein an average particle diameter of the filler is equal to or greater than about 0.8 times the thickness of the adhesive layer, and less than about 1 times the thickness of the adhesive layer.

公开(公告)号：US20240079260A1

公开(公告)日：2024-03-07

申请号：US18232589

申请日：2023-08-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hansol Yoo ,  Wonkeun Kim

IPC: H01L21/683 ,  C09J7/20 ,  H01L21/67

CPC classification number: H01L21/6836 ,  C09J7/20 ,  H01L21/67132 ,  C09J2203/326 ,  H01L2221/68327

Abstract: An adhesive tape sheet includes a dicing tape having an attachment region extending along an outer circumference thereof so as to be attached to a ring frame used when dicing a wafer, an adhesive film on the dicing tape radially inside of an inner boundary of the attachment region and to which the wafer is bonded, and an incision pattern portion within the attachment region and including first incision patterns that are spaced apart from each other along a first concentric circle having a first radius and second incision patterns that are spaced apart from each other along a second concentric circle having a second radius greater than the first radius. Each of the first incision patterns has a convex arch shape toward a center of the dicing tape, and each of the second incision patterns has a convex arch shape toward an outside of the dicing tape.