公开(公告)号：US11765812B2

公开(公告)日：2023-09-19

申请号：US17421043

申请日：2020-01-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Namseok Oh ,  Minkyu Shim ,  Hyunjae Kim

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0218 ,  H05K1/0228 ,  H05K1/185 ,  H05K2201/09063 ,  H05K2201/10121

Abstract: An electronic device according to various embodiments of the disclosure may include a printed circuit board constructed with a layered structure of a plurality of boards, and may include, among the plurality of boards, a circuit board constructed around a first region to which an acoustic component is disposed, and having at least one slit constructed to block a low-frequency band noise.