公开(公告)号：US20240028814A1

公开(公告)日：2024-01-25

申请号：US18348469

申请日：2023-07-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： QHwan KIM ,  Jaeyoon KIM ,  Hyeonkyun NOH ,  Ami MA ,  Sunghee LEE ,  Kyubaik CHANG ,  Wooyoung CHEON ,  Jaehoon JEONG

IPC: G06F30/398

CPC classification number: G06F30/398 ,  G06F2111/20

Abstract: A method for measuring a structure based on a spectrum, includes obtaining a first model that includes a first sub-model and a second sub-model following the first sub-model and is trained based on simulation data, generating a second model including a third sub-model identical to the first sub-model, training the second model based on sample spectrum data generated by measuring spectra of sample structures, and estimating, based on the trained second model, the structure from measured spectrum data generated by measuring a spectrum of the structure.

公开(公告)号：US20240402619A1

公开(公告)日：2024-12-05

申请号：US18404626

申请日：2024-01-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minkyu KIM ,  QHwan KIM ,  Ami MA ,  Sunghee LEE ,  Kyu-Baik CHANG ,  Jaehoon JEONG ,  Wanju CHO ,  Hanlim CHOI

IPC: G03F7/00

Abstract: An apparatus for predicting a structure of a semiconductor device, the apparatus includes: at least one processor; a storage configured to store a learned model configured to predict the structure of the semiconductor device; and a memory configured to store at least one code, and at least one processor operatively connected to the memory and configured to execute the at least one code to: input non-destructive metrology data measured from the semiconductor device into the learned model, and predict the structure of the semiconductor device, based on the learned model, wherein the learned model is trained with training data including first data which is non-destructive metrology data and second data which is structural metrology data as reference data of the first data, and wherein the training data is refined based on a similarity of the training data in a space having a first axis corresponding to the first data and a second axis corresponding to the second data as reference axes.

公开(公告)号：US20240211755A1

公开(公告)日：2024-06-27

申请号：US18453651

申请日：2023-08-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunghee LEE ,  QHwan KIM ,  Minkyu KIM ,  Bongseok KIM ,  Youngseok KIM ,  Ami MA ,  Jinkook PARK ,  Kyubaik CHANG ,  Jaehoon JEONG

IPC: G06N3/08

CPC classification number: G06N3/08

Abstract: Provided are a method of providing an artificial intelligence (AI) algorithm, an operation method of an AI algorithm, an electronic device, a recording medium, and a computer program. The method of providing the AI algorithm includes loading data sets with respect to a spectrum of a semiconductor and a structure of the semiconductor, calculating an out of distribution (OOD) index with respect to the spectrum of the semiconductor, performing data split by clustering sampling the data sets into at least one learning data set with respect to OOD indexes according to semiconductors, and providing an optimal AI algorithm from among a plurality of AI algorithms that have learned the at least one learning data set.