公开(公告)号：US20180315468A1

公开(公告)日：2018-11-01

申请号：US16032837

申请日：2018-07-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoon-Joo EOM ,  JOON-YOUNG PARK ,  YONGCHEOL BAE ,  WON YOUNG LEE ,  SEONGJIN JANG ,  JUNGHWAN CHOI ,  JOOSUN CHOI

IPC: G11C11/4096 ,  G11C11/4093 ,  G11C7/10

CPC classification number: G11C11/4096 ,  G11C7/1084 ,  G11C11/4093 ,  G11C2207/105

Abstract: A multi channel semiconductor device is disclosed. The multi channel device may include a substrate, a first die on the substrate and having a first channel to function as a first chip; and a second die on the substrate and having a second channel different from the first channel to function as a second chip and including the same storage capacity and physical size as the first die. An internal interface is disposed between the first and second dies. The internal interface is configured to transmit information for controlling internal operations of the first and second dies and first applied to a first recipient die of the first and second dies to the other die.

公开(公告)号：US20220366969A1

公开(公告)日：2022-11-17

申请号：US17875865

申请日：2022-07-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoon-Joo EOM ,  JOON-YOUNG PARK ,  YONGCHEOL BAE ,  WON YOUNG LEE ,  SEONGJIN JANG ,  JUNGHWAN CHOI ,  JOOSUN CHOI

IPC: G11C11/4096 ,  G11C11/4093 ,  G11C7/10

Abstract: An operation method of a semiconductor device is disclosed. The semiconductor device includes separate first and second dies in a package and receives first types of signals through first and second respective channels independent of each other and corresponding to the first and second respective dies. The method includes a step in which when information for controlling internal operations of the first and second dies is first applied to the first die through a first pad, the first die performs the internal operation and also transmits the information to the second die through an internal interface connecting the first die and the second die, and a step in which when the information is transmitted to the second die, the second die performs the internal operation.

公开(公告)号：US20190272867A1

公开(公告)日：2019-09-05

申请号：US16289747

申请日：2019-03-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoon-Joo EOM ,  JOON-YOUNG PARK ,  YONGCHEOL BAE ,  WON YOUNG LEE ,  SEONGJIN JANG ,  JUNGHWAN CHOI ,  JOOSUN CHOI

IPC: G11C11/4096 ,  G11C7/10 ,  G11C11/4093

Abstract: An operation method of a semiconductor device is disclosed. The semiconductor device includes separate first and second dies in a package and receives first types of signals through first and second respective channels independent of each other and corresponding to the first and second respective dies. The method includes a step in which when information for controlling internal operations of the first and second dies is first applied to the first die through a first pad, the first die performs the internal operation and also transmits the information to the second die through an internal interface connecting the first die and the second die, and a step in which when the information is transmitted to the second die, the second die performs the internal operation.

公开(公告)号：US20180166122A1

公开(公告)日：2018-06-14

申请号：US15889783

申请日：2018-02-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoon-Joo EOM ,  JOON-YOUNG PARK ,  YONGCHEOL BAE ,  WON YOUNG LEE ,  SEONGJIN JANG ,  JUNGHWAN CHOI ,  JOOSUN CHOI

IPC: G11C11/4096 ,  G11C7/10 ,  G11C11/4093

CPC classification number: G11C11/4096 ,  G11C7/1084 ,  G11C11/4093 ,  G11C2207/105

Abstract: A multi channel semiconductor device is disclosed. The multi channel device may include a substrate, a first die on the substrate and having a first channel to function as a first chip; and a second die on the substrate and having a second channel different from the first channel to function as a second chip and including the same storage capacity and physical size as the first die. An internal interface is disposed between the first and second dies. The internal interface is configured to transmit information for controlling internal operations of the first and second dies and first applied to a first recipient die of the first and second dies to the other die.