公开(公告)号：US20240227112A1

公开(公告)日：2024-07-11

申请号：US18225909

申请日：2023-07-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： SEUNGJUN LEE ,  Jinoh Im ,  ILYOUNG YOON

IPC: B24B37/013

CPC classification number: B24B37/013

Abstract: A chemical mechanical polishing apparatus according to an example embodiment includes a polishing platen; a polishing pad which is located on the polishing platen and includes a polishing surface; a slurry supplier configured to supply a slurry to the polishing pad; a polishing head which is located above the polishing pad and configured to mount a wafer thereon; and an additional CMP process condition generator which generates an additional chemical mechanical polishing (CMP) process condition according to a type of residue when there is a residue on a wafer after a CMP process is performed on the wafer.