公开(公告)号：US20180090821A1

公开(公告)日：2018-03-29

申请号：US15720872

申请日：2017-09-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Ha LEE ,  Kyung Jae LEE ,  Jae Ho LIM ,  Dong Hwan KIM ,  Young Jun KIM ,  Un KIM ,  Jong Hoon KIM ,  Min Seok PARK

IPC: H01Q1/24 ,  H01Q13/10 ,  H01Q1/38 ,  H01Q5/328 ,  H01Q9/04

CPC classification number: H01Q1/243 ,  H01Q1/38 ,  H01Q5/328 ,  H01Q5/35 ,  H01Q5/40 ,  H01Q9/04 ,  H01Q9/42 ,  H01Q13/10

Abstract: An electronic device includes a metal housing, a conductive member disposed adjacent to the metal housing, a plurality of ground parts including a first ground part electrically connected with a first point of the conductive member and a second ground part electrically connected with a second point of the conductive member, a ground plate electrically connected with the metal housing and electrically connected with the conductive member via the plurality of ground parts, and a feeding part electrically connected with the conductive member.