公开(公告)号：US20250091101A1

公开(公告)日：2025-03-20

申请号：US18627651

申请日：2024-04-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Jine PARK ,  Ji Hwan PARK ,  Kun Tack LEE

IPC: B08B7/00 ,  H01L21/67

Abstract: A substrate processing apparatus includes a reactor having a processing space formed therein, a fluid supply unit supplying a supercritical fluid into the processing space of the reactor, and a controller controlling the reactor and the fluid supply unit. The controller controls, in response to whether a state of the supercritical fluid supplied to the reactor satisfies a set condition, the reactor and the fluid supply unit to perform one of cleaning of the processing space by using the supercritical fluid and drying of a substrate seated in the processing space by using the supercritical fluid.