公开(公告)号：US10410886B2

公开(公告)日：2019-09-10

申请号：US15602599

申请日：2017-05-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： TaeYong Kwon ,  Sangjin Kim ,  Donghoon Hwang ,  Sebeom Oh ,  Yunkyeong Jang

IPC: H01L21/56 ,  H01L21/311 ,  H01L21/8234 ,  H01L23/544 ,  H01L21/308

Abstract: Methods of fabricating a semiconductor device are provided. The methods may include forming a lower mold layer on a substrate that includes first and second regions, forming first and second intermediate mold patterns on the first and second regions, respectively, forming first spacers on sidewalls of the first and second intermediate mold patterns, etching the lower mold layer to form first and second lower mold patterns on the first and second regions, respectively, and etching the substrate to form active patterns and dummy patterns on the first and second regions, respectively. A first distance between a pair of the first intermediate mold patterns may be greater than a second distance between a pair of the second intermediate mold patterns, and the second lower mold patterns may include at least one first merged pattern, whose width is substantially equal to the second distance.