公开(公告)号：US10664023B2

公开(公告)日：2020-05-26

申请号：US15650723

申请日：2017-07-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae Sik Kim ,  Myung Jae Jo ,  Hye Won Kang ,  Ja Myeong Koo ,  Mu Jin Kim ,  Jeong Woon Koo ,  Dae Heon Kwon ,  Sei Neu Park ,  Won Hyun Park ,  Jae Young Yun

IPC: H05K3/46 ,  H05K3/34 ,  H05K1/18 ,  H05K1/02 ,  G06F1/18 ,  G06F1/16 ,  G06F3/044

Abstract: An electronic device includes a bracket having a through hole, a first circuit board and a second circuit board which are disposed below the bracket. The second circuit board is electrically connected with the first circuit board, and a first module and a second module are disposed above the bracket. The first module and the second module are electrically connected with the first circuit board via a wiring structure passing through the through hole.