公开(公告)号：US20250079359A1

公开(公告)日：2025-03-06

申请号：US18785080

申请日：2024-07-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeong Wan HAN ,  Byung Kyu KIM ,  Jeonghun KIM ,  Tae-Hong KIM ,  Pyojin JEON ,  Seok Hwan JEONG

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/522 ,  H01L23/532 ,  H10B12/00

Abstract: A semiconductor chip includes a substrate. a device layer and an interconnection layer sequentially on the substrate, and a bonding pad on the interconnection layer. A bottom surface of the bonding pad may be located at a constant level, and a side surface of the bonding pad may have a roughened shape.