公开(公告)号：US09772296B2

公开(公告)日：2017-09-26

申请号：US14460814

申请日：2014-08-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung-Bok Kang ,  Seok-Min Kang ,  Bon-Ok Koo ,  Kyoung-Hwan Kim ,  Myung-Woo Kim ,  In-Gi Kim ,  Hyun-Chul Kim ,  Sung-Ki Roh ,  Gyung-Jin Min ,  Eun-Seok Lee ,  Jin-Suk Hong

IPC: G01N21/95 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01N21/8851 ,  G01N2021/8887

Abstract: In a method of inspecting a surface of a substrate, a first surface image of the substrate before loaded into a process chamber may be obtained. The first surface image may be processed to detect a defect on the surface of the substrate. Thus, the surfaces of all of the substrate may be inspected during a process may be performed without transferring the substrates.