公开(公告)号：US10243022B2

公开(公告)日：2019-03-26

申请号：US15350201

申请日：2016-11-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-min Lee ,  Kyoung-won Na ,  Dong-mo Im ,  Jung-wook Lim ,  Seok-jin Kwon

IPC: H01L27/30 ,  H01L27/146 ,  H01L51/44

Abstract: Image sensors are provided. An image sensor includes a color filter layer. The image sensor includes a metal structure adjacent a sidewall of the color filter layer. The image sensor includes an insulating layer on the color filter layer. Moreover, the image sensor includes an electrode layer on the insulating layer. Methods of forming image sensors are also provided.

公开(公告)号：US20190181183A1

公开(公告)日：2019-06-13

申请号：US16266531

申请日：2019-02-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-min Lee ,  Kyoung-won Na ,  Dong-mo Im ,  Jung-wook Lim ,  Seok-jin Kwon

IPC: H01L27/30 ,  H01L27/146

CPC classification number: H01L27/307 ,  H01L27/14612 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/1463 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14665 ,  H01L27/14685 ,  H01L27/14687 ,  H01L51/442 ,  H01L51/447 ,  H01L2251/301 ,  Y02E10/549

Abstract: Image sensors are provided. An image sensor includes a color filter layer. The image sensor includes a metal structure adjacent a sidewall of the color filter layer. The image sensor includes an insulating layer on the color filter layer. Moreover, the image sensor includes an electrode layer on the insulating layer. Methods of forming image sensors are also provided.

公开(公告)号：US20170170238A1

公开(公告)日：2017-06-15

申请号：US15350201

申请日：2016-11-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-min Lee ,  Kyoung-won Na ,  Dong-mo Im ,  Jung-wook Lim ,  Seok-jin Kwon

IPC: H01L27/30 ,  H01L51/44

CPC classification number: H01L27/307 ,  H01L27/14612 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/1463 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14665 ,  H01L27/14685 ,  H01L27/14687 ,  H01L51/442 ,  H01L51/447 ,  H01L2251/301

Abstract: Image sensors are provided. An image sensor includes a color filter layer. The image sensor includes a metal structure adjacent a sidewall of the color filter layer. The image sensor includes an insulating layer on the color filter layer. Moreover, the image sensor includes an electrode layer on the insulating layer. Methods of forming image sensors are also provided.

公开(公告)号：US11335732B2

公开(公告)日：2022-05-17

申请号：US16707002

申请日：2019-12-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-min Lee ,  Kyoung-won Na ,  Dong-mo Im ,  Jung-wook Lim ,  Seok-jin Kwon

IPC: H01L27/30 ,  H01L27/146 ,  H01L51/44

Abstract: Image sensors are provided. An image sensor includes a color filter layer. The image sensor includes a metal structure adjacent a sidewall of the color filter layer. The image sensor includes an insulating layer on the color filter layer. Moreover, the image sensor includes an electrode layer on the insulating layer. Methods of forming image sensors are also provided.

公开(公告)号：US10535715B2

公开(公告)日：2020-01-14

申请号：US16266531

申请日：2019-02-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-min Lee ,  Kyoung-won Na ,  Dong-mo Im ,  Jung-wook Lim ,  Seok-jin Kwon

IPC: H01L27/30 ,  H01L27/146 ,  H01L51/44

Abstract: Image sensors are provided. An image sensor includes a color filter layer. The image sensor includes a metal structure adjacent a sidewall of the color filter layer. The image sensor includes an insulating layer on the color filter layer. Moreover, the image sensor includes an electrode layer on the insulating layer. Methods of forming image sensors are also provided.