公开(公告)号：US20240006293A1

公开(公告)日：2024-01-04

申请号：US18143735

申请日：2023-05-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seon HEO

IPC: H01L23/498

CPC classification number: H01L23/49838 ,  H01L23/49816 ,  H01L23/49822 ,  H01L25/105

Abstract: A semiconductor package includes: a package substrate including a first region, a second region, a first surface, and a second surface opposing the first surface; a semiconductor chip mounted on the package substrate; a pad including a first sub-pad, which is disposed on the second surface of the first region, and a second sub-pad, which is disposed on the second surface of the second region and includes a solder ball recess; and a solder ball disposed on the second surface, wherein the solder ball includes a first sub-solder ball and a second sub-solder ball, wherein the first sub-solder ball is connected to the first sub-pad, and the second sub-solder ball is connected to the second sub-pad, wherein the second sub-solder ball includes a first portion and a second portion, wherein the first portion is disposed in the solder ball recess, and the second portion is disposed on the first portion.

公开(公告)号：US20220130019A1

公开(公告)日：2022-04-28

申请号：US17571664

申请日：2022-01-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Moonhwan JEONG ,  Yoonsang KIM ,  Sujung BAE ,  Inho CHOI ,  Seon HEO

IPC: G06T5/00 ,  G06N20/00 ,  G06T5/50 ,  G06N3/04 ,  G06V10/25 ,  G06V40/16

Abstract: An electronic device according to an embodiment disclosed herein may include a communication circuit, a processor; and a memory configured to be operatively connected to the processor. The memory according to an embodiment may store instructions that, when executed, cause the processor to: recognize an area comprising at least part of a face in an image to be transmitted to an external device; generate perturbation data about the recognized area based on a machine learning model stored in the memory; apply the perturbation data to the recognized area; and transmit the image to which the perturbation data has been applied to the external device. Various other embodiments are possible.