-
公开(公告)号:US20180361630A1
公开(公告)日:2018-12-20
申请号:US15959570
申请日:2018-04-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Min KIM , Yongha KIM , Hyun-Hee LEE , Minhyouk KIM , Seon-Jung KIM , Yuguen KIM , Hakju KIM , Seon KIM , Kyungtae BYUN
Abstract: According to various embodiments, there may be provided a housing manufacturing method including preparing a base material, disposing at least one patterned structure layer including a plurality of fillers on an upper portion of the base material, and disposing a protective layer on an upper portion of the patterned structure layer. In addition, the housing manufactured by the aforementioned manufacturing method may be applied to at least part of an exterior of an electronic device.
-
公开(公告)号:US20210130974A1
公开(公告)日:2021-05-06
申请号:US16481137
申请日:2017-11-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hakju KIM , Se Jin KIM , Hosoon LEE , Seon-Jung KIM , Wanju SIN , Kyuin LEE , Jiwoon LIM , Jong Wan JEONG
Abstract: According to various embodiments, a method for manufacturing a metal housing can be provided, comprising: a step of forming a metal base made of a metal material; a step of pretreating the surface of the metal base such that the surface has a predetermined gloss and flatness; an anodizing step of forming a predetermined oxide film on the flat surface of the metal base; a step of coloring the oxide film by using a colorant having a desired color; a sealing step for maintaining the performance and characteristics of the colorant on the colored oxide film; and a step of laminating at least one deposition layer on the upper part of the sealed oxide film.
-