MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

    公开(公告)号:US20230378315A1

    公开(公告)日:2023-11-23

    申请号:US18060037

    申请日:2022-11-30

    CPC classification number: H01L29/66492 H01L21/26586 H01L21/266

    Abstract: A manufacturing method of a semiconductor device including forming a photoresist pattern on a semiconductor substrate on which a gate electrode has been formed, forming a well region using both the photoresist pattern and the gate electrode as a mask, forming a lightly doped drain (LDD) region in the well region, using both the photoresist pattern and the gate electrode as a mask, reducing a thickness of the photoresist pattern by removing a portion of the photoresist pattern, forming a halo region below the LDD region using both the photoresist pattern and the gate electrode as a mask, and removing the photoresist pattern.

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