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公开(公告)号:US20230315167A1
公开(公告)日:2023-10-05
申请号:US18327440
申请日:2023-06-01
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seonghyeon KIM , Taeyoung BAE , Hyowon SEO
CPC classification number: G06F1/1698 , G06F1/1635 , H01Q1/40 , H05K5/04 , H05K5/0086
Abstract: An electronic device is provided. The electronic device includes a housing comprising a metal area and a resin area, a display disposed on the housing, and a battery disposed inside the housing. The metal area includes a first metal area supporting the battery, and at least one second metal area forming at least one part of a side surface of the electronic device, the at least one second metal area comprising a protruding structure protruding toward the first metal area. The resin area is disposed between the first metal area and second metal area. The protruding structure can include a first surface facing the resin area and a second surface toward the inside of the electronic device.
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公开(公告)号:US20210352392A1
公开(公告)日:2021-11-11
申请号:US17282527
申请日:2019-10-01
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seonghyeon KIM , Jungbae PARK , Hyosung KANG , Hyowon SEO , Haewon SUNG
Abstract: An electronic device according to an embodiment of the disclosure may include a body including a first face which faces a first direction, a second face which faces a second direction opposite to the first direction, and one or more side faces which face a third direction perpendicular to each of the first and second directions, and a rear case which is coupled along the one side faces and includes one or more microphone coupling structures. The rear case may include a rear case outer part, and a rear case inner part coupled to the rear case outer part through horizontal sliding. The microphone coupling structure may include a microphone acoustic duct constructed at the rear case outer part, a microphone rubber mounting portion constructed at the rear case inner part and inserted to the acoustic duct, and a microphone rubber assembled to the microphone rubber mounting portion and spatially coupled to the acoustic duct.
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