公开(公告)号：US20240379515A1

公开(公告)日：2024-11-14

申请号：US18419694

申请日：2024-01-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyoungok Jung ,  Jakyoung Gu ,  Seonghyun Yoo

IPC: H01L23/498 ,  H01L23/00 ,  H01L25/065

Abstract: A semiconductor package, that includes: a first semiconductor chip including first pads; a second semiconductor chip including second pads on a first surface facing the first semiconductor chip and in contact with the first pads, and including through-electrodes electrically connected to the second pads and extending to a second surface, opposite to the first surface; a first dielectric layer that covers the rear surface of the second semiconductor chip and a portion of each of side surfaces of the through-electrodes thereof; a second dielectric layer that surrounds a side surface of the second semiconductor chip; and bump structures on a planar surface defined by the first dielectric layer and the second dielectric layer, and electrically connected to the through-electrodes, The first dielectric layer may include an inorganic compound, and the second dielectric layer may include an organic-inorganic composite material having a lower coefficient of thermal expansion than the inorganic compound.

公开(公告)号：US20230154797A1

公开(公告)日：2023-05-18

申请号：US18055357

申请日：2022-11-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seonghyun Yoo ,  Yeonga Kim

IPC: H01L21/782 ,  H01L21/02 ,  H01L23/00

CPC classification number: H01L21/782 ,  H01L21/02348 ,  H01L24/02 ,  H01L2224/0231

Abstract: A method of manufacturing a semiconductor device includes forming a light blocking film configured to block first light within a first wavelength band on an edge region of an upper surface of a light-transmitting carrier substrate; forming a photosensitive adhesive layer on the upper surface of the light-transmitting carrier substrate to at least partially cover the light blocking film; bonding a product substrate to the upper surface of the light-transmitting carrier substrate using the photosensitive adhesive layer; partially curing the photosensitive adhesive layer by irradiating the light through the light-transmitting carrier substrate, wherein a portion of the photosensitive adhesive layer overlapping the light blocking film is not cured; processing the product substrate to form a plurality of semiconductor devices after the partially curing of the photosensitive adhesive layer; and cutting the product substrate such that the plurality of semiconductor devices are cut into a plurality of separate individual semiconductor devices.