公开(公告)号：US20230415439A1

公开(公告)日：2023-12-28

申请号：US18465525

申请日：2023-09-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chunghyo JUNG ,  Seonmi PARK ,  Hyein PARK

IPC: B29D99/00 ,  H05K5/02 ,  H01Q1/38 ,  H01Q1/24 ,  H04M1/02 ,  G06F1/16

CPC classification number: B29D99/006 ,  H05K5/02 ,  H01Q1/38 ,  H01Q1/243 ,  H04M1/0277 ,  G06F1/1626

Abstract: A method for producing an injection-molded article, according to various embodiments, comprises: molding an injection-molded article; irradiating, in a primary irradiation operation, a laser on primary irradiation regions spaced from each other, on at least a portion of the surface of the injection-molded article; irradiating, in a secondary irradiation operation, a laser on secondary irradiation regions spaced from each other, on at least a portion of the surface of the injection-molded article; and, on the surface of the injection-molded article, forming a plating layer on the primary irradiation regions and the secondary irradiation regions, wherein each of the secondary irradiation regions may at least partially overlap with at least one of the primary irradiation regions.