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1.
公开(公告)号:US20230049857A1
公开(公告)日:2023-02-16
申请号:US17885395
申请日:2022-08-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyein PARK , Deokhyeong YOO , Sangheon KIM , Mira SEO , Jungyeol AN , Seungyoon HEO , Yeunwook LIM
Abstract: According to an embodiment, an electronic device may comprise: a flexible display, at least one microphone, a sensor, a communication module comprising communication circuitry, and at least one processor operatively connected with the flexible display, the at least one microphone, the sensor, and the communication module. The at least one processor may be configured to: based on receiving a call signal from an external electronic device through the communication module, identify whether the call signal is a video call signal, based on the call signal being the video call signal, identify a folding state of the electronic device through the sensor, adjust a sound signal received through the at least one microphone based on the folding state, and control the communication module to transmit the adjusted sound signal to the external electronic device.
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2.
公开(公告)号:US20240429256A1
公开(公告)日:2024-12-26
申请号:US18828337
申请日:2024-09-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Gwangho CHOI , Hyein PARK , Jaedeok LIM
IPC: H01L27/146 , H04N23/56 , H04N23/57
Abstract: An electronic device according to an embodiment of the disclosure includes an upper structure that forms at least a portion of an exterior of the electronic device, a sensor module including a light emitting unit and a light receiving unit spaced apart from each other on a surface thereof that faces in a first direction and faces the upper structure, and a shielding structure that has a thin film form and surrounds at least a portion of the surface of the sensor module that faces in the first direction, the first direction being a direction in which the light emitting unit emits light. The upper structure is spaced apart from a surface of the shielding structure that faces in the first direction. The shielding structure includes a shielding film layer, a lusterless layer, and a diffuse reflection layer stacked on the sensor module in the first direction. The diffuse reflection layer is formed of a mixture of a plurality of silica particles and a binder and includes, on a surface of the diffuse reflection layer, a plurality of raised parts having a mountain shape, the width of which is decreased in the first direction.
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3.
公开(公告)号:US20240224410A1
公开(公告)日:2024-07-04
申请号:US18432920
申请日:2024-02-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jeongseok LEE , Hyein PARK , Jaedeok LIM
IPC: H05K1/02
CPC classification number: H05K1/0218 , H05K1/0215 , H05K2201/0112 , H05K2201/0707 , H05K2201/10151 , H05K2201/2054
Abstract: An electronic device according to an embodiment includes a printed circuit board including a ground pad, an optical sensor disposed on the printed circuit board, and a shielding member covering the optical sensor. The shielding member includes a first adhesive layer attached on the optical sensor and the ground pad, a first shielding layer electrically connected to the ground pad and disposed on the first adhesive layer, and a first cover layer disposed on the first shielding layer, the first cover layer including a plurality of first particles configured to reflect or scatter light, a plurality of second particles configured to absorb the light, and a binder covering the plurality of first particles and the plurality of second particles.
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公开(公告)号:US20230140971A1
公开(公告)日:2023-05-11
申请号:US18149497
申请日:2023-01-03
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sangil PARK , Myeongsil PARK , Juwan PARK , Hyein PARK , Jaehyoung YOU , Shinhyuk YOON , Jaedeok LIM , Gyuyeong CHO , Seungbum CHOI , Hyunju HONG
CPC classification number: G06F1/1679 , G06F1/1652 , G06F1/1656 , G06F1/1681 , H01F7/0278 , G06F1/1616
Abstract: An electronic device is provided. The electronic device includes a foldable housing which has a hinge structure including a first housing and a second housing, the first housing is connected to the hinge structure and includes a first surface facing a first direction, a second surface facing a second direction opposite the first direction, and a first side surrounding the space between the first second surface, and the second housing is connected to the hinge structure and includes a third surface facing a third direction, a fourth surface facing a fourth direction opposite the third direction, and a second side, the first surface facing the third surface when the electronic device is in a folded state, and the third direction being the same as the first direction when the electronic device is in an unfolded state, a flexible display extending from the first and third surface, and a magnet array.
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5.
公开(公告)号:US20230415439A1
公开(公告)日:2023-12-28
申请号:US18465525
申请日:2023-09-12
Applicant: Samsung Electronics Co., Ltd.
Inventor: Chunghyo JUNG , Seonmi PARK , Hyein PARK
CPC classification number: B29D99/006 , H05K5/02 , H01Q1/38 , H01Q1/243 , H04M1/0277 , G06F1/1626
Abstract: A method for producing an injection-molded article, according to various embodiments, comprises: molding an injection-molded article; irradiating, in a primary irradiation operation, a laser on primary irradiation regions spaced from each other, on at least a portion of the surface of the injection-molded article; irradiating, in a secondary irradiation operation, a laser on secondary irradiation regions spaced from each other, on at least a portion of the surface of the injection-molded article; and, on the surface of the injection-molded article, forming a plating layer on the primary irradiation regions and the secondary irradiation regions, wherein each of the secondary irradiation regions may at least partially overlap with at least one of the primary irradiation regions.
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6.
公开(公告)号:US20230257884A1
公开(公告)日:2023-08-17
申请号:US18137062
申请日:2023-04-20
Applicant: SAMSUNG ELECTRONICS CO, LTD. , INTOPS CO, LTD.
Inventor: Chunghyo JUNG , Wonjun KO , Hyein PARK , Yongsub LEE , Jaedeok LIM , Bumjin CHO , Chiyoung YOON , Keunha KIM , Kyungha KOO , Hongki MOON
CPC classification number: C23C18/2013 , H05K5/0247 , B23C3/30 , C23C18/1651 , C23C18/1689 , B23K26/364
Abstract: The present disclosure provides electronic device and methods of manufacturing the electronic devices. In some embodiments, the electronic device includes an outer housing at least partially forming an exterior of the electronic device, a trench including at least one valley and at least one peak, a first conductive member, and a coating layer laminated on the outer housing and disposed on the first conductive member. Each of the at least one valley is concave with respect to a surface of the outer housing. Each of the at least one peak is convex with respect to the surface of the outer housing and has a partially removed end. The trench is plated with the first conductive member.
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公开(公告)号:US20210161039A1
公开(公告)日:2021-05-27
申请号:US17060785
申请日:2020-10-01
Applicant: Samsung Electronics Co., Ltd.
Inventor: Chunghyo JUNG , Jaedeok LIM , Hyein PARK , Jaehyoung YOU
Abstract: An electronic device is provided. The electronic device includes a circuit board, at least one electric component disposed on one surface of the circuit board, a shield can mounted on the one surface of the circuit board, with the at least one electric component received in the shield can, and including at least one opening formed in an area corresponding to the at least one electric component, a shielding sheet disposed in at least a portion of the shield can and blocking at least a portion of the at least one opening, and a heat transfer member disposed in contact between the at least one electric component and the shielding sheet. The shielding sheet includes a flexible structure.
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8.
公开(公告)号:US20230400886A1
公开(公告)日:2023-12-14
申请号:US18456192
申请日:2023-08-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: Gihoon LEE , Gyuyeong CHO , Jaedeok LIM , Yongyoun KIM , Hyein PARK
CPC classification number: G06F1/1652 , G01D5/12 , G06F1/1641
Abstract: An example electronic device includes a first housing; a second housing coupled to be movable with respect to the first housing; a flexible display disposed on at least a portion of the first housing and the second housing; a magnet having at least two polarities arranged in a first direction in one plane; a sensor configured to move in the first direction along the central axis of the magnet as the arrangement of the second housing relative to the first housing is changed, and detect at least two or more direction components including a first direction component and a second direction component of magnetic flux density; a memory configured to store state reference information on a state of the electronic device corresponding to the first direction component and the second direction component; and a processor configured to obtain magnetic detection data including the at least two or more direction components from the sensor; and detect the state of the electronic device based on the obtained magnetic detection data and the state reference information.
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公开(公告)号:US20230063734A1
公开(公告)日:2023-03-02
申请号:US17883614
申请日:2022-08-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jaedeok LIM , Hyein PARK , Jaehyoung YOU , Woosup LEE , Taejun LIM , Gyuyeong CHO , Hana CHOE
Abstract: A power reception device includes: a housing including a first surface facing in a first direction, a second surface facing in a second direction opposite to the first direction, and a side surface surrounding a space between the first surface and the second surface; a coil antenna wound in a circle; a shielding sheet disposed over the coil antenna; and a first magnet and a second magnet adjacent to an outermost coil of the coil antenna and disposed to be spaced apart from the outermost coil. The first magnet is disposed so that a portion of magnetism induced by the first magnet is formed in the first direction. The second magnet is disposed so that a portion of the magnetism induced by the second magnet is formed in a third direction that is an outside direction from a center of the coil antenna.
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公开(公告)号:US20220312653A1
公开(公告)日:2022-09-29
申请号:US17841834
申请日:2022-06-16
Applicant: Samsung Electronics Co., Ltd.
Inventor: Myeonggil LEE , Hyein PARK , Jaedeok LIM , Jihye MOON , Cheehwan YANG , Jangsun YOO , Kwangyong LEE
Abstract: An electronic device and a shielding film are disclosed herein. The electronic device includes a printed circuit board and at least one electrical component mounted on the printed circuit board. The shielding film is disposed on at least a part of the printed circuit board to block electromagnetic waves generated by the printed circuit board and/or the electronic component. The shielding film includes a plurality of layers, and is attached to at least part of the printed circuit board and contacting an upper side surface of the electronic component, wherein at least part of the shielding film includes a nano-conductive fiber and is electrically connected with a ground part of the printed circuit board through the nano-conductive fiber.
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