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公开(公告)号：US20210380612A1
公开(公告)日：2021-12-09
申请号：US17144242
申请日：2021-01-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Chawon Koh , Moonil Jung , Tsunehiro Nishi , Kunwoo Baek , Mijeong Song , Jaehyun Kim , Seung Han
Abstract: Described herein are photoresist compositions comprising a metal structure including an organometallic compound, an organometallic nanoparticle, and/or an organometallic cluster; a C2 to C20 organic densifier including oxygen atoms; and a solvent. Also described herein are methods of using a photoresist composition.
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