公开(公告)号：US20150342523A1

公开(公告)日：2015-12-03

申请号：US14724220

申请日：2015-05-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunghyun BAIK ,  Daewoo SUH ,  Dongmok LEE ,  Sanghoon LEE

IPC: A61B5/00 ,  H01L35/16 ,  H01L35/18 ,  H02J7/35 ,  H01L35/20 ,  H01M10/46 ,  A61B5/11 ,  H01L35/32 ,  H01L35/22

CPC classification number: A61B5/6801 ,  A61B5/1118 ,  A61B5/6802 ,  A61B5/6831 ,  A61B2560/0219 ,  A61B2562/0276 ,  A61B2562/12 ,  H01L35/16 ,  H01L35/18 ,  H01L35/20 ,  H01L35/22 ,  H01L35/24 ,  H01L35/26 ,  H01L35/32 ,  H02J7/355

Abstract: A thermoelectric material includes a stretchable polymer, and a thermoelectric structure and an electrically conductive material that are mixed together with the stretchable polymer. The thermoelectric material may be applied to self-power generating wearable electronic apparatuses.

Abstract translation: 热电材料包括与可拉伸聚合物混合在一起的可拉伸聚合物和热电结构和导电材料。 热电材料可以应用于自发电可穿戴电子设备。

公开(公告)号：US20220328453A1

公开(公告)日：2022-10-13

申请号：US17519917

申请日：2021-11-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunghyun BAIK

IPC: H01L25/065 ,  H01L23/00

Abstract: A semiconductor package according to the exemplary embodiments of the disclosure includes a base substrate including a base bonding pad, a first semiconductor chip disposed on the base substrate, a first adhesive layer provided under the first semiconductor chip, a first bonding pad provided in a bonding region on an upper surface of the first semiconductor chip, a first bonding wire interconnecting the base bonding pad and the first bonding pad, and a crack preventer provided in a first region at the upper surface of the first semiconductor chip. The crack preventer includes dummy pads provided at opposite sides of the first region and a dummy wire interconnecting the dummy pads.

公开(公告)号：US20240100634A1

公开(公告)日：2024-03-28

申请号：US18370016

申请日：2023-09-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaeseok JANG ,  Seunghyun BAIK

IPC: B23K35/02 ,  B22F1/054 ,  B22F1/142 ,  B23K35/26 ,  C22C12/00 ,  C22C13/00 ,  C22F1/16 ,  C22F3/00 ,  H01L23/00

CPC classification number: B23K35/025 ,  B22F1/0553 ,  B22F1/056 ,  B22F1/142 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  C22C12/00 ,  C22C13/00 ,  C22F1/16 ,  C22F3/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  B22F2202/01 ,  B22F2304/058 ,  B23K2101/40

Abstract: A lead-free solder alloy composition includes a lead-free solder alloy; and a flower-shaped metal nano-particle including a metal core and protrusion portions extending from a surface of the metal core, wherein the metal core and the protrusion portions of the metal nano-particle include only one metal element.