公开(公告)号：US20220130884A1

公开(公告)日：2022-04-28

申请号：US17393855

申请日：2021-08-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dae Shik KIM ,  Min-Sun KEEL ,  Hoon Joo NA ,  Kang Ho LEE ,  Kil Ho LEE ,  Sang Kil LEE ,  Jung Hyuk LEE ,  Shin Hee HAN

IPC: H01L27/146

Abstract: An image sensor including a variable resistance element is provided. The image sensor comprises first and second chips having first and second connecting structures; and a contact plug connecting the first and second chips. The first chip includes a photoelectric conversion element. The second chip includes a first variable resistance element. The contact plug extends from the first surface of the first semiconductor substrate to connect the first and second connecting structures.