公开(公告)号：US20190174584A1

公开(公告)日：2019-06-06

申请号：US16138120

申请日：2018-09-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sin-Yeob LEE ,  Dong-Woo SHIN ,  Hyun-Seok CHOI

IPC: H05B6/64 ,  H05B6/80 ,  H01L25/10 ,  H01L25/00 ,  H01L21/263 ,  H01L21/324 ,  H01L21/67

Abstract: In a method of manufacturing an electronic device, a solder paste is coated on a substrate pad of a substrate. An electronic product is disposed on the substrate such that a solder on an input/output pad of the electronic product makes contact with the solder paste. A first microwave is generated toward the solder paste during a reflow stage to heat the solder paste. A phase of the first microwave is changed during the reflow stage. Heating of the solder paste causes the solder to reflow, thereby forming a solder bump between the substrate pad and the input/output pad.