公开(公告)号：US20240153906A1

公开(公告)日：2024-05-09

申请号：US18386687

申请日：2023-11-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byeongtak PARK ,  Gwanghee JO ,  Siwoong WOO ,  Jiwon SON ,  Yongjoo LEE ,  Hoechul KIM ,  Inhwa BAEK ,  Seungdae SEOK ,  Sehoon JANG ,  Jaehyun PHEE

IPC: H01L23/00

CPC classification number: H01L24/74 ,  H01L2224/74 ,  H01L2924/40

Abstract: A substrate bonding apparatus includes a first bonding chuck having a first base, a deformable plate on the first base to support a first substrate, and a lower pressurer under the first base to apply pressure to the deformable plate, and a second bonding chuck vertically spaced apart from the first bonding chuck and having a second base to fix a second substrate, and an upper pressurer to apply pressure to the second substrate. The deformable plate includes an outer portion surrounding a center portion, a bottom surface of the outer portion of the deformable plate being adhered to the first base, the center portion being deformable in the vertical direction by the lower pressurer, and thicknesses of the center and outer portions of the deformable plate in the vertical direction being different from each other.

公开(公告)号：US20240136231A1

公开(公告)日：2024-04-25

申请号：US18139674

申请日：2023-04-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Donggap SHIN ,  Yongin LEE ,  Wooyoung KIM ,  Bumki MOON ,  Jiwon MOON ,  Seungdae SEOK ,  Siwoong WOO ,  Byeongtak PARK

IPC: H01L21/66 ,  H01L23/00

CPC classification number: H01L22/12 ,  H01L24/74 ,  H01L24/80 ,  H01L24/08 ,  H01L2224/08145 ,  H01L2224/74 ,  H01L2224/8001 ,  H01L2224/80894 ,  H01L2224/80908 ,  H01L2924/3511 ,  H01L2924/35121 ,  H01L2924/401

Abstract: An apparatus for measuring an adhesion force, the apparatus comprising a stage configured to support a specimen, and a sensor adhered to the specimen, wherein the sensor detects the adhesion force of the specimen, the adhesion force of the specimen being a force for detaching the sensor from the specimen.

公开(公告)号：US20240234215A9

公开(公告)日：2024-07-11

申请号：US18139674

申请日：2023-04-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Donggap SHIN ,  Yongin LEE ,  Wooyoung KIM ,  Bumki MOON ,  Jiwon MOON ,  Seungdae SEOK ,  Siwoong WOO ,  Byeongtak PARK

IPC: H01L21/66 ,  H01L23/00

CPC classification number: H01L22/12 ,  H01L24/74 ,  H01L24/80 ,  H01L24/08 ,  H01L2224/08145 ,  H01L2224/74 ,  H01L2224/8001 ,  H01L2224/80894 ,  H01L2224/80908 ,  H01L2924/3511 ,  H01L2924/35121 ,  H01L2924/401

Abstract: An apparatus for measuring an adhesion force, the apparatus comprising a stage configured to support a specimen, and a sensor adhered to the specimen, wherein the sensor detects the adhesion force of the specimen, the adhesion force of the specimen being a force for detaching the sensor from the specimen.

公开(公告)号：US20220068688A1

公开(公告)日：2022-03-03

申请号：US17203036

申请日：2021-03-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gwanghee JO ,  Dongjoo MOON ,  Siwoong WOO ,  Sunjung KIM ,  Donggil SHIM ,  Huijae KIM ,  Seungdae SEOK

IPC: H01L21/68 ,  H01L21/683 ,  H01L21/677

Abstract: A semiconductor substrate alignment device includes: a lower chuck; a lower chuck driving unit; an upper chuck above and overlapping the lower chuck; observation windows in the upper chuck, imaging units respectively configured to irradiate light through the observation windows and to obtain images by detecting light reflected from the semiconductor substrates; a distance sensor configured to detect a distance between an edge of the lower chuck and an edge of the upper chuck; and a control unit configured to identify first and second alignment keys from images of first and second semiconductor substrates, determine an alignment error value of the first and second semiconductor substrates, and compensate for the alignment error value by driving the lower chuck driving unit.