公开(公告)号：US20210127514A1

公开(公告)日：2021-04-29

申请号：US17036981

申请日：2020-09-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daum Hwang ,  Snagin Baek

IPC: H05K5/02 ,  H05K5/03 ,  H05K5/00 ,  C09J7/29 ,  H04B1/3827 ,  B32B7/12 ,  B32B27/08

Abstract: An electronic device may include a housing including a support member in an inner space thereof, at least one conductive pattern disposed on the support member, a cover member combined with at least a part of the housing, a first adhesive member disposed between the housing and the cover member to be overlapped at least in part with the at least one conductive pattern when the cover member is viewed from above, and a first masking film member attached to the first adhesive member and disposed between the first adhesive member and the at least one conductive pattern to be overlapped with the at least one conductive pattern when the cover member is viewed from above. A surface of the first masking film member facing the at least one conductive pattern may include a photosensitive adhesive layer containing a photo-initiator and having an adhesive force reduced or removed through irradiation of ultraviolet (UV) rays.