公开(公告)号：US20200303270A1

公开(公告)日：2020-09-24

申请号：US16897468

申请日：2020-06-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： So Young LIM ,  Ye Chung CHUNG

IPC: H01L21/66 ,  H01L23/498 ,  H01L23/00 ,  H05K1/03 ,  H05K1/02

Abstract: A display device including a film substrate including first and second surfaces, the first surface being opposite to the second surface; a semiconductor chip disposed on the first surface and including an input terminal and a test terminal, which are arranged in a first direction; a first wire extending from the input terminal on the first surface along a second direction, which intersects the first direction; and a second wire including a first extended portion, which extends along the first surface, a second extended portion, which extends along the second surface, and a first via, which penetrates the film substrate and connects the first extended portion and the second extended portion, wherein the first extended portion extends from the test terminal in the second direction and is connected to the first via, and the second extended portion extends from the first via to an edge of the second surface.

公开(公告)号：US20220113577A1

公开(公告)日：2022-04-14

申请号：US17559590

申请日：2021-12-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung Hun HAN ,  Jung Eun KOO ,  So Young LIM

IPC: G02F1/1345 ,  H01L23/31 ,  H05K1/02 ,  H01L27/32 ,  H05K1/18 ,  H01L23/00

Abstract: A film type package includes: a base film having first and second sides; a driver integrated circuit mounted on the base film; first connection pads disposed on a first area of the base film that is adjacent to the first side of the base film, and configured to be connected to a first external circuit; second connection pads disposed on a second area of the base film that is adjacent to the second side of the base film, and configured to be connected to a second external circuit; first signal lines disposed on the base film, and connecting the driver integrated circuit and the first connection pads; second signal lines disposed on the base film, and connecting the driver integrated circuit and the second connection pads; and a plurality of test lines extending from the driver integrated circuit to the first side of the base film.

公开(公告)号：US20190122943A1

公开(公告)日：2019-04-25

申请号：US16115751

申请日：2018-08-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： So Young LIM ,  Ye Chung CHUNG

IPC: H01L21/66 ,  H01L23/498 ,  H01L23/00 ,  H05K1/03 ,  H05K1/02

Abstract: A display device including a film substrate including first and second surfaces, the first surface being opposite to the second surface; a semiconductor chip disposed on the first surface and including an input terminal and a test terminal, which are arranged in a first direction; a first wire extending from the input terminal on the first surface along a second direction, which intersects the first direction; and a second wire including a first extended portion, which extends along the first surface, a second extended portion, which extends along the second surface, and a first via, which penetrates the film substrate and connects the first extended portion and the second extended portion, wherein the first extended portion extends from the test terminal in the second direction and is connected to the first via, and the second extended portion extends from the first via to an edge of the second surface.