公开(公告)号：US20240362057A1

公开(公告)日：2024-10-31

申请号：US18469050

申请日：2023-09-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chung Woo PARK ,  Bo Youn PARK ,  Soung Kwan KIMN

IPC: G06F9/455 ,  G06F1/08

CPC classification number: G06F9/45558 ,  G06F1/08 ,  G06F2009/45575 ,  G06F2009/45591

Abstract: A system on chip includes a first core cluster configured to execute a first virtual machine loaded into a memory, the first core cluster including a plurality of first cores, and a second core cluster configured to execute a second virtual machine loaded into the memory, the second virtual machine including a plurality of second cores, wherein a first core of the plurality of first cores is configured to execute the first virtual machine at a first exception level (EL) to generate a first temperature value request, execute a hypervisor loaded into the memory at a second exception level different from the first exception level to receive a first temperature value from temperature management circuitry, in response to the first temperature value request, and execute the first virtual machine at the first exception level to check the received first temperature value, and wherein a second core of the plurality of second cores is configured to execute the second virtual machine at the first exception level to generate a second temperature value request, execute the hypervisor at the second exception level to receive a second temperature value from the temperature management circuitry, in response to the second temperature value request, and execute the second virtual machine at the first exception level to check the received second temperature value.