公开(公告)号：US10570264B2

公开(公告)日：2020-02-25

申请号：US15783315

申请日：2017-10-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyung Rim Kim ,  Nam Il Koo ,  Sun Kwon Kim ,  Jeong Ho Moon ,  Sun Woo Park ,  Jong Sung Lee ,  Ji Min Lee

IPC: C08J7/04 ,  C09D7/61 ,  C09D4/06 ,  C09D133/14 ,  G06F3/044

Abstract: A photocurable coating composition includes 50 to 150 parts by weight of a urethane acrylate oligomer having a number average molecular weight of 1300 to 1700 g/mol and 9 functional groups, 50 to 150 parts by weight of an acrylate monomer, 10 to 15 parts by weight of a photoinitiator, and 1 to 3 parts by weight of a surfactant.

公开(公告)号：US20180105662A1

公开(公告)日：2018-04-19

申请号：US15783315

申请日：2017-10-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyung Rim Kim ,  Nam Il Koo ,  Sun Kwon Kim ,  Jeong Ho Moon ,  Sun Woo Park ,  Jong Sung Lee ,  Ji Min Lee

IPC: C08J7/04 ,  C09D4/06 ,  C09D133/14 ,  C09D7/12 ,  G06F3/044

CPC classification number: C08J7/04 ,  C08F2222/1086 ,  C08J2333/14 ,  C08J2483/06 ,  C09D4/00 ,  C09D4/06 ,  C09D7/60 ,  C09D7/61 ,  C09D133/14 ,  G06F3/044 ,  G06F2203/04103 ,  C08F220/18 ,  C08L83/04

Abstract: A photocurable coating composition includes 50 to 150 parts by weight of a urethane acrylate oligomer having a number average molecular weight of 1300 to 1700 g/mol and 9 functional groups, 50 to 150 parts by weight of an acrylate monomer, 10 to 15 parts by weight of a photoinitiator, and 1 to 3 parts by weight of a surfactant.

公开(公告)号：US10658413B2

公开(公告)日：2020-05-19

申请号：US16029260

申请日：2018-07-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sun Woo Park ,  Sun Hyun Kim ,  Ho Woo Park ,  Eung Kyu Lee ,  Chang Keun Lee ,  Hisanori Ihara

IPC: H01L27/146 ,  H01L23/00

Abstract: A semiconductor device includes a lower insulating layer on a lower substrate, a lower pad structure inside the lower insulating layer, an upper insulating layer on the lower insulating layer, an upper pad structure inside the upper insulating layer, and an upper substrate on the upper insulating layer. A via plug passes through at least a portion of each of the upper substrate, the upper insulating layer, and the lower insulating layer, and in contact with the upper pad structure and the lower pad structure. The upper pad structure includes upper pad conductive layers and an upper connection layer between the upper pad conductive layers. The upper connection layer includes a conductive pattern having a shape different from a shape of at least one of the upper pad conductive layers. The via plug is in direct contact with the upper pad conductive layers and the upper connection layer.